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Results 1-10 of 11 (Search time: 0.617 seconds).

Dictionary based compression type classification using a CNN architecture

Song, Hyewon; Kwon, Beom; 이성민; Lee, Sanghoon

ConferenceIssue Date2019Place중국
WARPINGFUSION: ACCURATE MULTI-VIEW TSDF FUSION WITH LOCAL PERSPECTIVE WARP

Kang, Jiwoo; 이성민; Jang, Mingyu; Yoon, Hyunse; 이상훈

ConferenceIssue Date2210Place미국
Physical parameter prediction by embedding human perceptual parameter for 3D garment modeling

이성민; Kim, Woojae; Ahn, Sewoong; Kim, jaekyung; 이상훈

ConferenceIssue Date2017Place중국
A deep cybersickness predictor based on brain signal analysis for virtual reality contents

Kim, Jinwoo; Kim, Woojae; Oh, Heeseok; Lee, Seongmin; Lee, Sanghoon

ConferenceIssue Date2019Place대한민국
Image Inpainting using Weighted Mask Convolution

Kang, Jiwoo; Lee, Seongmin; Lee, Sanghoon

ConferenceIssue Date2020Place뉴질랜드
FaceClone: Interactive Facial Shape and Motion Cloning System Using Multi-View Images

Lee, Kyungjune; Lee, Jeonghaeng; Lee, Hyucksang; 이성민; Jang Mingyu; Lee, Sanghoon

ConferenceIssue Date2023Place호주
A Comparison and Evaluation of Stereo Matching on Active Stereo ImagesGo to Linkopen access

Jang, M.; Yoon, H.; Lee, Seongmin; Kang, J.; Lee, S.

ArticleIssue Date2022CitationSensors, v.22, no.9PublisherMDPI
Gradient Flow Evolution for 3D Fusion From a Single Depth SensorGo to Link

Kang, Jiwoo; Lee, Seongmin; Jang, Mingyu; Lee, Sanghoon

ArticleIssue Date2022CitationIEEE Transactions on Circuits and Systems for Video Technology, v.32, no.4, pp 2211 - 2225PublisherInstitute of Electrical and Electronics Engineers
Competitive Learning of Facial Fitting and Synthesis Using UV Energy

JIWOO KANG; SEONGMIN LEE; Sanghoon Lee

ArticleIssue Date2022CitationIEEE TRANSACTIONS ON SYSTEMS MAN CYBERNETICS-SYSTEMS, v.52, no.5, pp 2,858 - 2,873PublisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Technical Consideration towards Robust 3D Reconstruction with Multi-View Active Stereo Sensors

MINGYU JANG; SEONGMIN LEE; JIWOO KANG; Sanghoon Lee

ArticleIssue Date2022CitationSENSORS, v.22, no.11, pp 4142-1 - 4142-15PublisherMDPI AG
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