Electrical and Electronic Engineering (전기전자공학과)185
Recent Submissions
- WARPINGFUSION: ACCURATE MULTI-VIEW TSDF FUSION WITH LOCAL PERSPECTIVE WARP
- Reducing contact resistance of MoS2-based field effect transistors through uniform interlayer insertion via atomic layer deposition
- Investigation on Contact Properties of 2D van der Waals Semimetallic 1T-TiS<sub>2</sub>/MoS<sub>2</sub> Heterojunctions
- Self-Enabled Write-Assist Cells for High-Density SRAM in a Resistance-Dominated Technology Node
- Selective passivation of 2D TMD surface defects by atomic layer deposited Al2O3 to enhance recovery properties of gas sensor
- MRI-Compatible, Transparent PEDOT:PSS Neural Implants for the Alleviation of Neuropathic Pain with Motor Cortex Stimulation
- Ultrafast and thermally stable ternary Ge0.33SexSy ovonic threshold switching selector using magnetron sputtering
- Recent Advances in Functionalization and Hybridization of Two‐Dimensional Transition Metal Dichalcogenide for Gas Sensor
- Atomic layer deposition of Pt nanoparticles using dimethyl (<i>N</i>, <i>N</i>–dimethyl-3-butene-1-amine−<i>N</i>) platinum and H2 reactant and its application to 2D WS2 photodetectors
- Investigation of direct surface charge transfer of glutamic acids on 2D monolayer molybdenum disulfide and its sensing properties