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High-Resolution 3D Printing for Electronics

Authors
YOUNG-GEUN PARKInsik Yun정원기WONJUNG PARKDONGHA LEEJANG-UNG PARK
Issue Date
Mar-2022
Publisher
Wiley-vch Verlag GmbH &Co
Keywords
High-resolution; 3D printing; Electronics; Next-generation
Citation
Advanced Science, v.9, no.8, pp 2104623-1 - 2104623-29
Journal Title
Advanced Science
Volume
9
Number
8
Start Page
2104623-1
End Page
2104623-29
URI
https://yscholarhub.yonsei.ac.kr/handle/2021.sw.yonsei/23073
DOI
10.1002/advs.202104623
ISSN
2198-3844
Abstract
The ability to form arbitrary 3D structures provides the next level of complexity and a greater degree of freedom in the design of electronic devices. Since recent progress in electronics has expanded their applicability in various fields in which structural conformability and dynamic configuration are required, high-resolution 3D printing technologies can offer significant potential for freeform electronics. Here, the recent progress in novel 3D printing methods for freeform electronics is reviewed, with providing a comprehensive study on 3D-printable functional materials and processes for various device components. The latest advances in 3D-printed electronics are also reviewed to explain representative device components, including interconnects, batteries, antennas, and sensors. Furthermore, the key challenges and prospects for next-generation printed electronics are considered, and the future directions are explored based on research that has emerged recently.
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College of Engineering > 공과대학 신소재공학부 > 공과대학 신소재공학과 > 1. Journal Articles

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